Product category: |
1layer, 2layers and Multi-layer layers up to 6 layers |
Monthly output: |
Mass: 3,000 square meters/ month, Prototypes:2,000 square meters/ month |
Factory premises area: |
5000 Square meters |
Employees number: |
300 Persons |
Base material: |
FR4 |
Surface finish: |
Hasl, Hasl leadfree, Gold finger, Immersion gold |
|
Items |
Mass Production |
Prototypes |
Layers |
1-8 Layers |
1-6 Layers |
Max. Panel Size |
600*770mm( 23.62"*30.31") |
500*500mm(19.69"*19.69") |
Max.Board Thickness |
8.5mm |
2.4mm |
Min. Board Thickness |
2L:0.3mm |
2L:0.4mm |
4L:0.4mm |
4L:0.4mm |
6L:0.8mm |
6L:0.6mm |
Min Inner Layer Clearance |
0.175mm(7mil) |
0.153mm(6 mil) |
Min Line width |
0.1mm(4/4 mil) |
0.153mm(6 mil) |
Min Line space |
0.1mm(4/4 mil) |
0.153mm(6 mil) |
Min.Hole Size |
0.2mm(8mil) |
0.3mm(12mil) |
Min plated hoe thickness |
0.020mm(0.8mil) |
0.020mm(0.8mil) |
Min Blind/Buried hole size |
0.2mm(8mil) |
no blind/buried hole |
PTH Dia. Tolerance |
±0.076mm(±3mil) |
±0.153mm(±6mil) |
Non PTH Dia. Tolerance |
±0.05mm(±2mil) |
±0.08mm(±3.15mil) |
Hole Position Tolerance |
±0.05mm(±2mil) |
±0.08mm(±3.15mil) |
Heavy Copper |
4OZ/140μm |
2OZ/70μm |
Min S/M Pitch |
0.1mm (4mil) |
0.1mm (4mil) |
Soldermask color |
Green,black,Blue,White,Yellow,Red |
Green,black,Blue,White,Yellow,Red |
Silkscreen color |
White,Yellow,Red,Black |
White,Yellow,Red,Black |
Outline |
Routing,V-Groove, Beveling punch |
Routing,V-Groove, Beveling punch |
Outline Tolerance |
±0.15mm ±6mil |
±0.15mm (±6mil) |
Peelable mask |
Top,bottom,double sided |
Top,bottom,double sided |
Controlled Impedance |
+/- 10% |
no |
Insulation Resistance |
1×1012Ω(Normal) |
1×1012Ω(Normal) |
Through Hole Resistance |
<300m-ohms |
<300-ohms |
Thermal Shock |
3×10sec@288℃ |
3×10sec@288℃ |
Warp and Twist |
≤0.7% |
≤0.7% |
Dielectric Strength |
>1.3KV/mm |
>1.4KV/mm |
Peel Strength |
1.4N/mm |
1.4N/mm |
Solder Mask Abrasion |
>6H |
>6H |
Flammability |
94V-0 |
94V-0 |
Test Voltage |
50-330V |
50-330V |
|